ECG KOKUSAI Co., Ltd.

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SIP lead frame attaching soldering machine ADL-980

Ease of use, we have also realized lower prices.

Features

It is possible to unite with the characteristic of each work, and for a maximum of 9 steps to subdivide, and to program the up-and-down speed and dip time to a solder dip tub by application of microcomputer technology. This dip data can input up-and-down speed, stop time, and the amount of up-and-down movements for every step, respectively, and can set up the optimal soldering conditions for a work.
To 50 kinds, the inputted dip data is memorized by backup RAM and can be called at any time if needed. Dealing also with a plan substitute quickly is possible.
Adoption of the new method realized not less than 30% of improvement in the speed compared with old equipment. (Our comparison) Moreover, removal of a solder icicle is also performed simultaneously.
Adoption of the new method realized not less than 30% of improvement in the speed compared with old equipment. (Our comparison) Moreover, removal of a solder icicle is also performed simultaneously.
The input of dip data can be easily performed by key operation, looking at LCD (liquid-crystal-display screen) on a panel.

Specification

Lead frame attachment machine FI-930T type use
Lead frame standard size cut length MAX 280mm
An application lead frame size and a substrate size W:65mm or less
D:40mm or less
L1:8~20mm
L2:55mm or less
T:0.6~8mm
(It is clamper exchange when T is 9?13 mm.) A clamper is an option.
The direction of a work flow The left -> right
Work conveyance Belt conveyance -> mechanism zipper system
Flux application Dip system (sub tub up-and-down system)
Preheating system Far-infrared heater(0~200℃)
Soldering system Dip system (the solder sub tub up-and-down system by a pulse motor, a 0.1-mm step arbitrary setting good, and a display are liquid crystal display)
Baton time About 12 seconds (it contains for about 3 seconds solder immersion time)
Dip system An arbitrary setup in key operation is possible till 0 to 9.9 seconds.
Solder surface dregs removal Each time, it is based on a scraper.
Solder icicle removal It is based on a ceramic heater.
Work recovery it is based on an exclusive career -- dropping
Memory function 50 kinds (they are an arbitrary setup and liquid crystal display by key operation, such as the amount of soldering up-and-down movements, immersion time, and up-and-down speed)
Power supply 200V (single phase), 50/60 Hz, 30A
Common sky pressure Dry air 5kg/cm2 Air pressure display (panel side)
Outside dimension L abbreviation 1,910 x W 985 x H 1,390mm
Weight About 250 kg
Solder tub capacity About 20 kg
Painting color ECG standard color (2.5V7.6/1.4 leather color)